Potting vs Low Pressure Molding
The 3 main choices are:
- Low Pressure Molding
- High Pressure Molding
Potting was used for many years by manufacturers, and is considered the traditional method of protecting electrical components. Liquid resin is poured over the component and then it is cured until it forms a hard protective barrier. The downsides to this method are longer production times due to the curing process, and the risk of the resin shrinking over time means it could also damage components.
Low Pressure Molding
Low Pressure Molding came about as a solution for delicate electrical components, such as PCB’s, sensors and some cable assemblies. It uses a low amount of pressure to inject plastic into a mold. It offers increased protection compared with potting and has a cleaner and faster production time.
High Pressure Molding
High Pressure Molding is ideal for components that can withstand increased pressure. Plastic is injected at high pressure and can take on more complex forms, offering a wide variety of custom solutions that have the highest durability of any process available today. This process is also much faster than other solutions and is ideal for high volume.
Low Pressure and High Pressure Molding
Sometimes you want to make sure you have the toughest electrical component possible, but it’s too delicate for high pressure molding. How do you get around this? You can look at getting a low pressure mold done first—to strengthen the component to be able to withstand the high pressure injection process. This gives your components the ultimate solution in electrical component protection.
Here at MRO we have an in-house injection molding and CNC tooling shop. We can provide both low pressure and high pressure molds for a range of connectivity solutions. We also provide custom tooling so we can create the perfect mold for your application. Check out our manufacturing capabilities for more information, or contact us today to discuss overmolding with one of our experts.