860-4G SILICONE HEAT TRANSFER COMPOUND. 4g POUCH

MRO Part # 860-4G

860 is a CPU heat sink compound. This thermal paste designed to reduce thermal resistance between irregular metal surfaces. Coupled with reasonable thermal conductivity, 860 has a soft consistency and a wide operating temperature range, which in some instances makes it the best thermal paste for CPU applications. Non-electrically conductive. Service temperature range of -40 to 200 °C (-40 to 392 °F)

860 SDS